(The picture shows the bag)
Extended data DIP package uses:
The chip in this packaging mode has two rows of pins, which can be directly welded on the chip socket with DIP structure or at the welding positions with the same number of welding holes. Its characteristic is that it can easily realize PCB punching and welding, and has good compatibility with the motherboard. However, its packaging area and thickness are relatively large, and the pins are easy to be damaged when plugging and unplugging, so the reliability is poor.
At the same time, due to the influence of technology, this packaging method generally does not exceed 100 pin. With the high integration of CPU, DIP package quickly withdrew from the historical stage. Their footprints can only be seen on old VGA/SVGA graphics cards or BIOS chips.
References:
Baidu encyclopedia "DIP"